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Номенклатурный номер: 8009420630
Бренд: TE Connectivity

Описание

1.0MM Centerline Locking HPI Solutions

TE Connectivity's 1.0MM Centerline Locking High Performance Interconnect (HPI) Solutions offer right angle and vertical PCB mounting orientations and 3 to 15 position sizes. The locking feature strengthens the mating connection between the plug assembly and the receptacle, helping alleviate accidental unmating from pulling. Gold plating is available and protects against erosion in harsh environment applications. TE 1.0MM HPI Solutions are ideal for drones, printers, home appliances, and consumer electronics.

Технические параметры

Application: Wire-to-Board
Brand: TE Connectivity
Contact Gender: Pin(Male)
Contact Material: Copper Alloy
Contact Plating: Tin
Factory Pack Quantity: Factory Pack Quantity: 1400
Flammability Rating: UL 94 V-0
Housing Color: Black
Housing Material: Thermoplastic(TP)
Latching Type: Unlatched
Manufacturer: TE Connectivity
Maximum Operating Temperature: +85 C
Minimum Operating Temperature: -40 C
Mounting Angle: Straight
Mounting Style: SMD/SMT
Number of Positions: 3 Position
Number of Rows: 1 Row
Pitch: 1 mm
Product Category: Headers & Wire Housings
Product Type: Headers & Wire Housings
Product: Headers
Subcategory: Headers & Wire Housings
Termination Style: Solder
Type: Shrouded
Количество Контактов 3контакт(-ов)
Количество Рядов 1ряд(-ов)
Крышка разъема Shrouded
Материал Контакта Copper Alloy
Покрытие Контакта Tin Plated Contacts
Системы разъемов Wire-to-Board
Тип Оконцовки Контакта Surface Mount Straight
Шаг Контактов 1мм

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