ADUM241E1BRWZ-RL, SOIC-16-300mil Digital Isolators
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см. техническую документацию
см. техническую документацию
3 570 ֏
от 10 шт. —
2 470 ֏
1 шт.
на сумму 3 570 ֏
Описание
Isolators for Power Conversion
Analog Devices Isolators for Power Conversion reduce noise interference while offering safety and insulation, especially in high voltage and high power applications. These isolation components keep interface circuits separate from circuits that are dangerous to touch. Analog Devices Isolators for Power Conversion provide high insulation reliability under high temperature and high voltage.
Analog Devices Isolators for Power Conversion reduce noise interference while offering safety and insulation, especially in high voltage and high power applications. These isolation components keep interface circuits separate from circuits that are dangerous to touch. Analog Devices Isolators for Power Conversion provide high insulation reliability under high temperature and high voltage.
Технические параметры
| Brand: | Analog Devices |
| Data Rate: | 150 Mb/s |
| Factory Pack Quantity: Factory Pack Quantity: | 1000 |
| Forward Channels: | 3 Channel |
| Isolation Type: | Magnetic Coupling |
| Isolation Voltage: | 5000 Vrms |
| Manufacturer: | Analog Devices Inc. |
| Maximum Operating Temperature: | +125 C |
| Minimum Operating Temperature: | -40 C |
| Moisture Sensitive: | Yes |
| Mounting Style: | SMD/SMT |
| Number of Channels: | 4 Channel |
| Operating Supply Current: | 11.4 mA |
| Package / Case: | SOIC-16 |
| Polarity: | Unidirectional |
| Product Category: | Digital Isolators |
| Product Type: | Digital Isolators |
| Propagation Delay Time: | 7.2 ns |
| Reverse Channels: | 1 Channel |
| Series: | ADuM241E |
| Subcategory: | Interface ICs |
| Automotive | No |
| Coupling Type | Magnetic Coupling |
| ECCN (US) | EAR99 |
| EU RoHS | Compliant |
| Forward/Reverse Channels | 3/1 |
| Lead Shape | Gull-wing |
| Maximum Data Rate | 150Mbps(Min) |
| Maximum Fall Time (ns) | 2.5(Typ) |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Operating Temperature (°C) | 125 |
| Maximum Power Dissipation (mW) | 2780 |
| Maximum Propagation Delay Skew (ns) | 7.5 |
| Maximum Propagation Delay Time (tPHL) (ns) | 14 |
| Maximum Propagation Delay Time (tPLH) (ns) | 14 |
| Maximum Quiescent Supply Current (mA) | 17/10 |
| Maximum Rise Time (ns) | 2.5(Typ) |
| Maximum Working Insulation Voltage | 849Vp |
| Minimum Common Mode Rejection (kV/us) | 75 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Minimum Operating Temperature (°C) | -40 |
| Mounting | Surface Mount |
| Number of Channels per Chip | 4 |
| Output Type | CMOS |
| Packaging | Tape and Reel |
| Part Status | Active |
| PCB changed | 16 |
| Pin Count | 16 |
| PPAP | No |
| Standard Package Name | SO |
| Supplier Package | SOIC W |
| Type | General Purpose |
| Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
| Вес, г | 0.17 |
