CSD19534Q5A

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Номенклатурный номер: 8023011410
Бренд: Texas Instruments

Описание

NexFET™ Power MOSFETs

Texas Instruments NexFET™ Power MOSFETs deliver half the gate charge for the same resistance so that designers can achieve 90% power-supply efficiencies with double the frequency. These NexFET power MOSFETs combine vertical current flow with a lateral power MOSFET. These devices provide a low on resistance and require an extremely low gate charge with industry-standard package outlines. Texas Instruments NexFET Power MOSFET technology improves energy efficiency in high-power computing, networking, server systems, and power supplies.

Технические параметры

Brand: Texas Instruments
Channel Mode: Enhancement
Configuration: Single
Factory Pack Quantity: Factory Pack Quantity: 2500
Fall Time: 6 ns
Forward Transconductance - Min: 47 S
Id - Continuous Drain Current: 50 A
Manufacturer: Texas Instruments
Maximum Operating Temperature: +150 C
Minimum Operating Temperature: -55 C
Mounting Style: SMD/SMT
Number of Channels: 1 Channel
Package / Case: VSONP-8
Pd - Power Dissipation: 63 W
Product Category: MOSFET
Product Type: MOSFET
Qg - Gate Charge: 17 nC
Rds On - Drain-Source Resistance: 15.1 mOhms
Rise Time: 14 ns
Series: CSD19534Q5A
Subcategory: MOSFETs
Technology: Si
Tradename: NexFET
Transistor Polarity: N-Channel
Transistor Type: 1 N-Channel
Typical Turn-Off Delay Time: 20 ns
Typical Turn-On Delay Time: 9 ns
Vds - Drain-Source Breakdown Voltage: 100 V
Vgs - Gate-Source Voltage: -20 V, +20 V
Vgs th - Gate-Source Threshold Voltage: 2.4 V
Channel Mode Enhancement
Channel Type N
Maximum Continuous Drain Current 50 A
Maximum Drain Source Resistance 1.51e+007 O
Maximum Drain Source Voltage 100 V
Maximum Gate Threshold Voltage 2.4V
Mounting Type Surface Mount
Number of Elements per Chip 1
Package Type VSONP
Pin Count 8
Series NexFET
Transistor Material Si
Automotive No
Configuration Single Quad Drain Triple Source
ECCN (US) EAR99
EU RoHS Compliant with Exemption
Lead Shape No Lead
Material Si
Maximum Continuous Drain Current (A) 50
Maximum Continuous Drain Current on PCB @ TC=25°C (A) 10
Maximum Diode Forward Voltage (V) 1
Maximum Drain Source Resistance (mOhm) 15.1@10V
Maximum Drain Source Voltage (V) 100
Maximum Gate Resistance (Ohm) 2.2
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Source Voltage (V) ±20
Maximum Gate Threshold Voltage (V) 3.4
Maximum IDSS (uA) 1
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) 50
Maximum Operating Temperature (°C) 150
Maximum Positive Gate Source Voltage (V) 20
Maximum Power Dissipation (mW) 3200
Maximum Power Dissipation on PCB @ TC=25°C (W) 3.2
Maximum Pulsed Drain Current @ TC=25°C (A) 137
Minimum Gate Threshold Voltage (V) 2.4
Minimum Operating Temperature (°C) -55
Mounting Surface Mount
Operating Junction Temperature (°C) -55 to 150
Packaging Tape and Reel
Part Status Active
PCB changed 8
PPAP No
Process Technology NexFET
Product Category Power MOSFET
Standard Package Name SON
Supplier Package VSONP EP
Typical Diode Forward Voltage (V) 0.8
Typical Fall Time (ns) 6
Typical Gate Charge @ 10V (nC) 17
Typical Gate Charge @ Vgs (nC) 17@10V
Typical Gate Plateau Voltage (V) 4.1
Typical Gate Threshold Voltage (V) 2.8
Typical Gate to Drain Charge (nC) 3.2
Typical Gate to Source Charge (nC) 5.1
Typical Input Capacitance @ Vds (pF) 1290@50V
Typical Output Capacitance (pF) 257
Typical Reverse Recovery Charge (nC) 134
Typical Reverse Recovery Time (ns) 53
Typical Reverse Transfer Capacitance @ Vds (pF) 5.7@50V
Typical Rise Time (ns) 14
Typical Turn-Off Delay Time (ns) 20
Typical Turn-On Delay Time (ns) 9
Transistor Polarity N Channel; Continuous Drain Current Id

Техническая документация

Datasheet CSD19534Q5A
pdf, 398 КБ