CSD19532KTT, Транзистор: N-MOSFET

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Номенклатурный номер: 8024195828
Бренд: Texas Instruments

Описание

NexFET™ Power MOSFETs

Texas Instruments NexFET™ Power MOSFETs deliver half the gate charge for the same resistance so that designers can achieve 90% power-supply efficiencies with double the frequency. These NexFET power MOSFETs combine vertical current flow with a lateral power MOSFET. These devices provide a low on resistance and require an extremely low gate charge with industry-standard package outlines. Texas Instruments NexFET Power MOSFET technology improves energy efficiency in high-power computing, networking, server systems, and power supplies.

Технические параметры

Channel Type N
Maximum Continuous Drain Current 200 V
Maximum Drain Source Voltage 100 V
Mounting Type Surface Mount
Package Type DDPAK/TO-263
Brand: Texas Instruments
Channel Mode: Enhancement
Configuration: Single
Factory Pack Quantity: Factory Pack Quantity: 500
Fall Time: 2 ns
Forward Transconductance - Min: 113 S
Id - Continuous Drain Current: 200 A
Manufacturer: Texas Instruments
Maximum Operating Temperature: +175 C
Minimum Operating Temperature: -55 C
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of Channels: 1 Channel
Package / Case: TO-263-3
Pd - Power Dissipation: 250 W
Product Category: MOSFET
Product Type: MOSFET
Qg - Gate Charge: 44 nC
Rds On - Drain-Source Resistance: 5.6 mOhms
Rise Time: 3 ns
Series: CSD19532KTT
Subcategory: MOSFETs
Technology: Si
Tradename: NexFET
Transistor Polarity: N-Channel
Transistor Type: 1 N-Channel
Typical Turn-Off Delay Time: 14 ns
Typical Turn-On Delay Time: 9 ns
Vds - Drain-Source Breakdown Voltage: 100 V
Vgs - Gate-Source Voltage: -20 V, +20 V
Vgs th - Gate-Source Threshold Voltage: 2.2 V
Automotive No
Channel Mode Enhancement
Configuration Single
ECCN (US) EAR99
EU RoHS Compliant with Exemption
Lead Shape Gull-wing
Material Si
Maximum Continuous Drain Current (A) 200
Maximum Diode Forward Voltage (V) 1
Maximum Drain Source Resistance (mOhm) 5.6@10V
Maximum Drain Source Voltage (V) 100
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Source Voltage (V) ±20
Maximum Gate Threshold Voltage (V) 3.2
Maximum IDSS (uA) 1
Maximum Operating Temperature (°C) 175
Maximum Positive Gate Source Voltage (V) 20
Maximum Power Dissipation (mW) 250000
Minimum Operating Temperature (°C) -55
Mounting Surface Mount
Number of Elements per Chip 1
Operating Junction Temperature (°C) -55 to 175
Packaging Tape and Reel
Part Status Active
PCB changed 3
Pin Count 4
PPAP No
Process Technology NexFET
Product Category Power MOSFET
Standard Package Name TO-263
Supplier Package DDPAK
Tab Tab
Typical Fall Time (ns) 2
Typical Gate Charge @ 10V (nC) 44
Typical Gate Charge @ Vgs (nC) 44@10V
Typical Gate Threshold Voltage (V) 2.6
Typical Gate to Drain Charge (nC) 5.6
Typical Gate to Source Charge (nC) 17
Typical Input Capacitance @ Vds (pF) 3890@50V
Typical Rise Time (ns) 3
Typical Turn-Off Delay Time (ns) 14
Typical Turn-On Delay Time (ns) 9
Maximum Continuous Drain Current - (A) 200
Maximum Drain Source Resistance - (mOhm) 5.6@10V
Maximum Drain Source Voltage - (V) 100
Maximum Gate Source Voltage - (V) ??20
Maximum Gate Threshold Voltage - (V) 3.2
Maximum Power Dissipation - (mW) 250000
Military No
Operating Temperature - (??C) -55~175
Typical Gate Charge @ 10V - (nC) 44
Typical Gate Charge @ Vgs - (nC) 44@10V
Typical Input Capacitance @ Vds - (pF) 3890@50V
Вес, г 1.78

Техническая документация

Datasheet
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